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Modified Electrodeposited Polymer Coating for Enhanced Plating Adhesion

IP.com Disclosure Number: IPCOM000100122D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 1 page(s) / 54K

Publishing Venue

IBM

Related People

Authors:
Imken, RL [+details]

Abstract

Electrodeposited (ED) or electrophoretic polymer coatings are useful as dielectric sealants for anodized aluminum printed wiring boards using polymer thick film (PTF) pastes for conductor lines. As a means of increasing density of circuit lines and also conductivity of circuit lines, it is desirable to plate the electrodeposited coating. After the plating, photoimaging, and etching steps, a circuitized printed wiring board can be produced.