Browse Prior Art Database

Modified Electrodeposited Polymer Coating for Enhanced Plating Adhesion Disclosure Number: IPCOM000100122D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 1 page(s) / 54K

Publishing Venue


Related People

Imken, RL [+details]


Electrodeposited (ED) or electrophoretic polymer coatings are useful as dielectric sealants for anodized aluminum printed wiring boards using polymer thick film (PTF) pastes for conductor lines. As a means of increasing density of circuit lines and also conductivity of circuit lines, it is desirable to plate the electrodeposited coating. After the plating, photoimaging, and etching steps, a circuitized printed wiring board can be produced.