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Chip Carrier Disclosure Number: IPCOM000100150D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 52K

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Related People

Buehne, I: AUTHOR [+1]


This article describes a novel carrier for integrated semiconductor devices.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 63% of the total text.

Chip Carrier

       This article describes a novel carrier for integrated
semiconductor devices.

      The ceramic carriers currently used are made up of individual
sheets.  These sheets, into which a hole pattern is punched, are
provided with screen-printed vias and a conductor pattern.   A
plurality of such sheets placed on top of each other and then fired
yield a ceramic carrier.

      In the process described in this article, punching or drilling
of the individual carrier layers is eliminated. The carrier, thus
produced, has solid metallic vias in the form of a hole pattern.
Several conductor planes are not required.  The carrier may be made
of a variety of materials, such as glass, plastics or metal.

      Wires suiting the diameters of the desired chip contacts and
vias as well as the module pins, which may all have different
diameters, are molded parallel to each other in a carrier substrate.
For a metallic carrier substrate, insulated wires must be used.
After the molding compound has solidified, an elongated block is
obtained, inside of which the wires are molded parallel to the
block's center axis.

      Thin slices of this block, cut off perpendicular to its center
axis, have vias and contact areas for chip contacting and for
accommodating the module pins.

      These contacts are obtained by the remainder of the parallel
molded wires contained in each slice.

      The conductor pattern may be applied by providing the surfac...