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Method for fiber-filled syntactic organic substrate resins Disclosure Number: IPCOM000100627D
Publication Date: 2005-Mar-15
Document File: 4 page(s) / 87K

Publishing Venue

The Prior Art Database


Disclosed is a method for fiber-filled syntactic organic substrate resins. Benefits include improved functionality and improved reliability.

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Method for fiber-filled syntactic organic substrate resins

Disclosed is a method for fiber-filled syntactic organic substrate resins. Benefits include improved functionality and improved reliability.


      Cracking and fractures can be caused by thermo-mechanical stresses applied to a build-up layer substrate, a conventional substrate, or a conventional organic package (see Figure 1).

      Crack growth and fracture propagation must be mitigated. This problem is conventionally unsolved. Attempts to resolve the fracture problem include the addition of a metallic core internal to the substrate or package to change the effective composite expansion coefficient of the entire substrate or package.

General description

      The disclosed method is the inorganic fiber filling of organic resins used to manufacture electronic substrates and electronic packages and the prevention or mitigation of fracture tearing of the cured organic-resin system.

      Select categories of inorganic fibers and/or whiskers are prepared and mixed with one of the liquid resin system components. The fibers or whiskers are selected according to their properties. For example, they can be electrically nonconductive. They can be sized with respect to length or diameter and can possess high tensile strength or other thermo-mechanical properties. Fiber preparation can include the application of suitable wetting agents and/or cutting fibers into very small micro-length segments or into clumped bundles.

      After the preparation and blending of fibers, the remaining organic constituents are mixed. The prepared fibers are homogeneously dispersed throughout the entire resin system mixture (syntactic resin). It is used in place of conventional organic-resin mixtures in the manufacturing of organic electronic substrates or organic electronic packages. They can contain single or multiple layers of patterned electrical conductors, traces, and/or other features, which are adhered with and separated by the syntactic resin.

      Holes or vias can be placed in the syntactic resin and metalized using conventional technology to provide electrical connections between electrical conductors and traces. If thermo-mechanical stresses initiate a crack in the electrical substrate, the dispersed fibers or whiskers within the cured resin system mitigate or prevent the crack from propagating. However, the disclosed method does not stop the initiation of a fracture within the organic material.

      The disclosed method could be used in conjunction with additive build-up organic substrates with internal metallic core construction techniques or used with conventional resin-glass fabric construction techniques.


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