Modular Enclosure for Direct Chip Attached to Flex Cable/Circuits

Modular Enclosure for Direct Chip Attached to Flex Cable/Circuits

       This article describes the construction/design of a
semi-hermetic enclosure for semiconductor devices directly attached
to flex cables, preventing damage to the devices while enhancing the
heat dissipation of the device.

      Referring to the figure, a double-hinged enclosure is
constructed from material with high thermal conduction properties,
e.g., copper, aluminum, etc. The width of the enclosure is determined
by the dimensions of the flex circuit. It consists of a metal housing
having one fixed hinge and another hinge with a removable lock pin.
The protective enclosure is formed by the hinged metal plates and
compliant insulating gaskets attached to the plates. The thickness of
the gaskets is determined by the device and thermal conductive layer
dimensions, typically 1 - 1.5 mm.

      The enclosure mechanism attaches to both sides of the cable and
by depressing the open side, the gaskets are pressed against each
other, capturing and confining the direct mounted chips to the flex
cable.  Also, when the hinged mechanism is closed, the back side of
all captured devices is pressed against a thermally conductive
compliant material  forming the inside lining of the hinge. Once the
sleeves of a closed hinge are aligned with each other, a lock pin is
inserted, securing the double hinge to the flex cable. The outside
area of the hinge can be designed to include fins or protrusions to
reduc...