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Solder Paste Applicator

IP.com Disclosure Number: IPCOM000102571D
Original Publication Date: 1990-Dec-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 2 page(s) / 41K

Publishing Venue


Related People

Caron, A: AUTHOR [+2]


This invention is directed to the uniform application of solder paste to parts to be tinned.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Solder Paste Applicator

       This invention is directed to the uniform application of
solder paste to parts to be tinned.

      As shown in the drawing, a film of solder paste 1 is applied to
a roller 2 from solder paste reservoir 3 and by means of scrapper 4.
The thickness of the solder paste film could be of the order of 7
mils.  Parts to be soldered, in this example pinned substrates 5, are
passed under applicator roller 2 at a slower speed than the roller is
being rotated.  This results in paste being transferred onto the pin
heads of the parts ready for firing and tinning.

      Parts 5 are moved by a continuous feeder belt (not shown) to
keep the parts abutted to one another.  Parts 5 are continuously fed
under the applicator roller 2 and after solder paste transfer they
can be directly deposited in traypacks.

      The continuous feeder belt upon which the parts are aligned is
kept flat and in contact with roller 2 by a spring-loaded table 6, 7.
If circumstances require, an air pressure source 8 can be used to
pull the parts 5 away from roller 2 after the parts have contacted
the solder paste on the roller.

      The invention results in uniform application of solder paste to
parts, provides for uniform tinning of the parts and improvement of
the quality of tinning over conventional techniques.