Pressurized Air Support During via Hole Punching

IP.com Disclosure Number: IPCOM000107446D
Original Publication Date: 1992-Feb-01
Included in the Prior Art Database: 2005-Mar-21

Document File: 1 page(s) / 38K

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Publishing Venue

IBM

Related People

Hermann, K: AUTHOR [+4][-]

Abstract

A method is disclosed for punching a substrate material (1) wherein the need for a die behind the material is eliminated. For ultra small, high velocity punches alignment of the die to the punch is very difficult to initialize and maintain. By pressurizing each side of the material to be punched, the substrate becomes suspended in space. Using a very high speed punch, a hole of the required dimensions can be punched in the suspended material without a backing die.

Country

United States

Language

English (United States)

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Pressurized Air Support During via Hole Punching

A method is disclosed for punching a substrate material (1)
wherein the need for a die behind the material is eliminated. For
ultra small, high velocity punches alignment of the die to the punch
is very difficult to initialize and maintain. By pressurizing each
side of the material to be punched, the substrate becomes suspended
in space. Using a very high speed punch, a hole of the required
dimensions can be punched in the suspended material without a backing
die.

Disclosed anonymously.