Browse Prior Art Database

Soldering Process for DCA Using Solder Foils or Tapes

IP.com Disclosure Number: IPCOM000107498D
Original Publication Date: 1992-Feb-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Authors:
Mahmoud, IS [+details]

Abstract

Direct chip attach is an interconnection method which bonds the chip directly onto the circuit substrate or carrier. There are several techniques which the electronic industry has been investigating including: plating, solder jets and solder paste screening. These techniques have inherent problems or disadvantages such as lack of uniform thickness, misregistration and solder bridging in fine pitch, as is the case with DCA circuitry.