HAT Area Array Interconnections
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24
Publishing Venue
IBM
Related People
Hernandez, B: AUTHOR [+3]
Abstract
Area array interconnections cannot be solder reflowed for either placement or removal with the conventional form of hot air thermode (HAT). Heated nitrogen at critical velocities is necessary to effect the solder reflow and with the area to be soldered extending to the center of the package it is imperative to provide jets capable of supplying gas parallel to the board surface. The engineering drawing included shows a sectioned view of the package/Hat nozzle capable of supplying the correct directional flow. To keep a dynamic gas flow it will be necessary to have one or more of the jets providing a negative pressure.
HAT Area Array Interconnections
Area array
interconnections cannot be solder reflowed for
either placement or removal with the conventional form of hot air
thermode (HAT). Heated nitrogen at
critical velocities is necessary
to effect the solder reflow and with the area to be soldered
extending to the center of the package it is imperative to provide
jets capable of supplying gas parallel to the board surface. The
engineering drawing included shows a sectioned view of the
package/Hat nozzle capable of supplying the correct directional flow.
To keep a dynamic gas flow it will be necessary to have one or more
of the jets providing a negative pressure.
Disclosed anonymously.
