HAT Area Array Interconnections

IP.com Disclosure Number: IPCOM000109473D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24

Document File: 1 page(s) / 38K

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Publishing Venue

IBM

Related People

Hernandez, B: AUTHOR [+3][-]

Abstract

Area array interconnections cannot be solder reflowed for either placement or removal with the conventional form of hot air thermode (HAT). Heated nitrogen at critical velocities is necessary to effect the solder reflow and with the area to be soldered extending to the center of the package it is imperative to provide jets capable of supplying gas parallel to the board surface. The engineering drawing included shows a sectioned view of the package/Hat nozzle capable of supplying the correct directional flow. To keep a dynamic gas flow it will be necessary to have one or more of the jets providing a negative pressure.

Country

United States

Language

English (United States)

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This is the abbreviated version, containing approximately 100% of the total text.

HAT Area Array Interconnections

Area array interconnections cannot be solder reflowed for
either placement or removal with the conventional form of hot air
thermode (HAT). Heated nitrogen at critical velocities is necessary
to effect the solder reflow and with the area to be soldered
extending to the center of the package it is imperative to provide
jets capable of supplying gas parallel to the board surface. The
engineering drawing included shows a sectioned view of the
package/Hat nozzle capable of supplying the correct directional flow.
To keep a dynamic gas flow it will be necessary to have one or more
of the jets providing a negative pressure.

Disclosed anonymously.