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Peeler Mechanism for Thin Films Disclosure Number: IPCOM000109590D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 3 page(s) / 138K

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Freisitzer, N: AUTHOR [+5]


This article describes a method and hardware enablement for applying photoresist to wafers from a roll.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Peeler Mechanism for Thin Films

       This article describes a method and hardware enablement
for applying photoresist to wafers from a roll.

      Typically, the method of applying photoresist to wafers up to
125 mm in diameter is by a spinning process.  In this process,
photoresist is applied to the surface of the wafer while the wafers
are spun at a high speed.  The photoresist is spread over the wafers
by centrifugal force leaving a fairly uniform film on the wafers.

      However, this method is not acceptable for the 200 mm wafers.
Due to the increase in diameter, photoresist does not flow uniformly
enough for the etching process to be effective.

      Photoresist is applied in a roll form consisting of layers of
mylar, photoresist and polyolefin, as shown in Fig. 1.  The thickness
of these layers is consistent through the roll.  In the 200 mm,
photoresist apply tool, photoresist is applied to a wafer by punching
a cylindrical sandwich consisting of layers of mylar, photoresist,
and polyolefin.  This sandwich is held in position by sticking the
mylar side to a tape which is mounted on a linear drive that is used
to transport and position the sandwich during the photoresist
lamination process, as shown in Figs. 1 and 2.  In this process, it
is necessary to remove the polyolefin from the sandwich prior to the
photoresist and wafer lamination operation.  Traditionally, this film
would be removed by gripping one end and pulling this end back across
the sandwich until the film was totally removed.  In this process,
the photoresist layer may be damaged trying to grip the edge of the
polyolefin and during the peel operation by causing distortions,
scraping and/or impressions on the photoresist film layer.
Additionally, the polyolefin is subject to tearing due to the minute
area that is gripped on its edge.

      This article describes a process/me...