Browse Prior Art Database

Circular Terminal Polyimide Vias for Wirebond Products

IP.com Disclosure Number: IPCOM000111190D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Authors:
Balbo, G Lionti, M [+details]

Abstract

Disclosed is a special design for wet-etched vias in polyimide terminal passivation layer on wire bond products. Current vias design involve square/rectangular vias which allow wire bonding on the terminal metallurgy layer. From manufacturing experience, the following problems may occur which are a direct consequence of this square design :