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Circular Terminal Polyimide Vias for Wirebond Products Disclosure Number: IPCOM000111190D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 2 page(s) / 37K

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Related People

Balbo, G Lionti, M [+details]


Disclosed is a special design for wet-etched vias in polyimide terminal passivation layer on wire bond products. Current vias design involve square/rectangular vias which allow wire bonding on the terminal metallurgy layer. From manufacturing experience, the following problems may occur which are a direct consequence of this square design :