Quadpack Lead Coplanarity Improvement Device

Quadpack Lead Coplanarity Improvement Device

      The issue of quadpack lead coplanarity problems caused by
improper handling and/or forming can be improved by the use of the
tool described herein.  The tool is designed to apply pressure to all
of the quadpack formed leads on a given plane around the periphery of
the device body.  The pressure is applied to the leads via the
tooling blades shown in the Figure.  Leads that are above or below
the plane of the blades are forced into the plane by the pressure
supplied by the weight of the tool when the device is placed on a
circuit card as shown in the Figure.

      The Figure shows the quadpack coplanarity device loaded with a
quadpack device (2) and positioned on circuit board circuitry (3).
The quadpack (2) is positioned into the center of the tool and held
in place by magnet (4).  The blades (1) are positioned on the four
sides of the device body (5) via screws 6.  The blades are covered
with polyimide film sheet (7) to prevent metallurgical bonding to the
leads (8) during the subsequent soldering process that solders the
leads to the circuit board circuitry (3).  The plastic sheet is held
in place by clamp (9).