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Infrared Chip-Removal Tool Disclosure Number: IPCOM000112066D
Original Publication Date: 1994-Apr-01
Included in the Prior Art Database: 2005-Mar-26
Document File: 4 page(s) / 104K

Publishing Venue


Related People

Davis, DE: AUTHOR [+2]


A tool was required for use with the robotic component removal workstation that:

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 60% of the total text.

Infrared Chip-Removal Tool

      A tool was required for use with the robotic component removal
workstation that:

o   provides radiant infrared (IR) heat to reflow the solder mounting
    components to a Multi-Layered Ceramic (MLC) substrate,

o   serves as a mask to shield the heat from all parts of the
    substrate other than the removal site, and

o   Provides a vacuum pickup nozzle to lift the component from the
    substrate once the solder is reflowed.

      In addition, the tool was required to work in removing both
chips and capacitors, and to be easily interchangeable, since the
robot on which it mounts during component removal also uses other
End-Of-Arm Tooling (EOAT) to dress the removal site and to transport
substrates from one station to another withn the workstation.  The
Infrared Chip-Removal Tool disclosed here fulfills these

      The Figs. show the tool in front elevation (Fig. 1), side
elevation (Fig. 2), top plan view (Fig. 3), and detailed cross
section (Fig. 4).

      The probe assembly 4 and IR lamp assembly 2 are held together
by the frame 1, which is attached to the yaw bearing assembly 9
through the ball slide 8.  This allows the frame 1 to float relative
to the yaw bearing and provides vertical compliance between the robot
and the substrate being worked.

      The counterbalance cylinder 7 is attached between the fixed and
moving parts of the ball slide 8 in such a way that air pressure to