Browse Prior Art Database

Ceramic via Configuration Disclosure Number: IPCOM000112670D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 26K

Publishing Venue


Related People

Kim, J Olson, RW Ritsko, JJ Walker, GF [+details]


Circuit package integrity is more easily maintained by using an interconnecting via configuration for stacked ceramic layers that interlocks with each layer and distributes stress during expansion encountered in processing.