Browse Prior Art Database

Ceramic via Configuration

IP.com Disclosure Number: IPCOM000112670D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Authors:
Kim, J Olson, RW Ritsko, JJ Walker, GF [+details]

Abstract

Circuit package integrity is more easily maintained by using an interconnecting via configuration for stacked ceramic layers that interlocks with each layer and distributes stress during expansion encountered in processing.