Cleaning and Activation Solution for Parts which are Plated in Electroless Goldbaths
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Electroless goldbaths comprising a reduction agent for the gold deposition are used for plating bondable gold-layers on printed circuits and MCMs (organic/ceramic).
Cleaning and Activation Solution for Parts which are
Plated in Electroless
goldbaths comprising a reduction agent for the gold
deposition are used for plating bondable gold-layers on printed
circuits and MCMs (organic/ceramic).
Due to the
fact that these goldbaths are relatively unstable
regarding overplating and throwing power, it is necessary that no
surface contamination of organic or metallic origin can occur.
The following pretreatment can be used to clean and activate
before the gold plating.
NaCN/KCN 2-5 g/l
HO 1-5 g/l
Wetting Agent 0.05-0.1 g/l (perfluorite type agent)
Time 0.5-4 min.
using peroxide, bubbling air could be used as an
oxidation agent. When peroxide is used, the life time of the
solution is limited to 2-3 hours. After that time the cyanide will
The life time
of the bath can be increased by using air only
when there are parts in the activtion tank.
soluble complex-compounds with Nickel, Copper and
Gold (mostly base materials) and is removing this metallic
contamination from insulated areas, so that problems with overplating
could be reduced. Also the base material is partially attacked by
the cyanide. Thus, the surface of the part becomes more active and
the throwing power of the electroless goldbath...