Browse Prior Art Database

Integrated Packaging Design

IP.com Disclosure Number: IPCOM000113326D
Original Publication Date: 1994-Aug-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 4 page(s) / 77K

Publishing Venue

IBM

Related People

Authors:
Farringer, JA Hortensius, PD Hufford, GD Lamoreux, JF Lucente, SA Mathewson, JA Miller, BD Rudisill, CA Whittle, DJ [+details]

Abstract

Disclosed is a mechanically and electrically integrated packaging design for ease of manufacturing, small volume, low weight and system flexibility.