Solder Leveling/Removing Tool for Surface Mounted Technology Component Leads
Original Publication Date: 1994-Dec-01
Included in the Prior Art Database: 2005-Mar-28
Ervin, WM: AUTHOR [+2]
Disclosed here is a tool for removing and leveling solder on surface mounted components. It is used to prepare the components for reuse after they have been desoldered.
Solder Leveling/Removing Tool for Surface Mounted
here is a tool for removing and leveling solder on
surface mounted components. It is used to prepare the components for
reuse after they have been desoldered.
When surface mounted (SMT) devices are
removed from assemblies
for reclamation or other purposes, there is excess solder left on the
leads. The amount and shape of the solder on the leads is quite
variable. This excess solder interferes with the placement of the
components back onto another circuit card (particularly when it is
being placed by automated equipment). There are two main problems:
1. Excess solder can cause bridges.
2. The solder affects the coplanarity of the leads as viewed by
placement machines, causing them to reject the devices.
tool, as shown in the accompanying Figure, passes
hot air over the leads to blow off the excess solder. This is then
collected by a vacuum tube mounted on the other side of the lead.
The hot air is supplied by a soldering tool (such as an EDSYN * model
PS537). The air is directed over the lead and away from the
component body. This avoids heating the bodies of the components.
The hot air
pencil and vacuum tube are mounted to a fixture
which allows them to be positioned over the device. The device
itself is placed in the fixture with its leads up. The fixture table
can then move back and for...