Original Publication Date: 1995-Feb-01
Included in the Prior Art Database: 2005-Mar-29
Gallent, JJ: AUTHOR [+4]
Disclosed is a device which uses a combination of vacuum and pressure to effect low pressure (<50 PSI) and low temperature (<125ºC) vacuum lamination without the use of an autoclave or vacuum assisted hydraulic lamination press.
a device which uses a combination of vacuum and
pressure to effect low pressure (<50 PSI) and low temperature
(<125ÂºC) vacuum lamination without the use of an autoclave or
vacuum assisted hydraulic lamination press.
electronics assemblies are cooled by the use of
conduction. Circuit cards are bonded to one or both sides of metal
heatsinks. Often these heatsinks have complicated geometries because
of configuration requirements of the next higher assembly unit. The
electronics on the circuit cards are often packaged in leaded
components with lead counts up to 340 and lead dimensions as small as
.007" x .006". These leads are usually bent in a "Z" shape to allow
thermal expansion stresses to be absorbed in the lead. However, the
"Z" form, the lead material dimensions, and their proximity to
adjacent leads (often <.015") make uniform, low pressure, conforming
contact lamination of circuit cards to heatsinks a necessity.
vacuum lamination is accomplished through the use
of large, complicated equipment such as autoclaves or vacuum assisted
hydraulic lamination presses. In order to have a working lamination
area of 24" x 24", these pieces of equipment can be bulky, costly,
and require significant facility services such as steam, power, air,
exhaust, and cooling. The disclosed tool provides the capability to
perform vacuum lamination at a lower initial investment and can...