Improved Bellows for Wafer Process Cup
Original Publication Date: 1995-Sep-01
Included in the Prior Art Database: 2005-Mar-30
Publishing Venue
IBM
Related People
Morou, P: AUTHOR [+2]
Abstract
The goal of the modification is to avoid leaks of developer and De-Ionized (DI) water into the motor/encoder parts of the developer spin-on equipment. Standard equipment designs for the resist development process are not well adapted to a manufacturing environment because they produce too many fails and result in a high cost of spare parts, thus, extra manpower for equipment maintenance.
Improved Bellows for Wafer Process Cup
The goal of
the modification is to avoid leaks of developer and
De-Ionized (DI) water into the motor/encoder parts of the developer
spin-on equipment. Standard equipment
designs for the resist
development process are not well adapted to a manufacturing
environment because they produce too many fails and result in a high
cost of spare parts, thus, extra manpower for equipment maintenance.
This problem
is simply solved by introducing a TEFLON* bellows
in the developer spin-on equipment. The
bellows is placed between
the backside rinse adaptor (which supports the wafer chuck) on the
one hand and the frame containing the motor/encoder on the other
hand. The bellows is adapted to provide
a sealable link between the
parts while permitting the up and down movement of the motor spindle
attached to the adaptor. The bellows,
therefore, prevents any
ingress
of the developer in the sensitive parts of the spin-on equipment.
*
Trademark of E. I. du Pont de Nemours and Company.