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Electro-Magnetic Interference-Clip High Speed Interconnect Disclosure Number: IPCOM000117325D
Original Publication Date: 1996-Feb-01
Included in the Prior Art Database: 2005-Mar-31
Document File: 6 page(s) / 230K

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Weekly, RD [+details]


Disclosed is a method which minimizes Electro-Magnetic Interference (EMI) radiation in a low cost manner without jeopardizing the ability to install and change feature modules in a simple manner. No hard attachments, such as screws, between the pluggable modules and the faceplate are need (Fig. 1). Application is pluggable modules mounted through a faceplate (part of the system chassis electrical EMI containment enclosure) on a tight pitch and residing on opposite sides of a carrier PC board. Copper cables shown as twinax plug in to exposed ends of the pluggable module to form links with other boxes.