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Self-Contained Active Heat Dissipation Device

IP.com Disclosure Number: IPCOM000117605D
Original Publication Date: 1996-Apr-01
Included in the Prior Art Database: 2005-Mar-31

Publishing Venue

IBM

Related People

Authors:
Anderson, TM Chrysler, GM Chu, RC [+details]

Abstract

Disclosed is a method of enhancing the heat transfer coefficient within and around the fins of a heat sink without relying on increased system pressure drop or increased Air Moving Device (AMD) flow output. The enhancement is accomplished by providing extra mixing of the cooling air as it passes through the heat sink through the application of one or more piezoelectric pumps.