Browse Prior Art Database

Repair Process for Ball Grid Arrays

IP.com Disclosure Number: IPCOM000117900D
Original Publication Date: 1996-Jul-01
Included in the Prior Art Database: 2005-Mar-31

Publishing Venue

IBM

Related People

Authors:
Boyd, A Garrity, J Murray, KS Robertson, BL [+details]

Abstract

The repair of assemblies using Ball Grid Array (BGA) component technology often results in short and open circuits which are difficult to detect during the repair process. The improved process described below enables inspection of the new solder at the repair site prior to fitting a new component.