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Three-Row Footprint Allowing Placement of Multiple Package Types Disclosure Number: IPCOM000117922D
Original Publication Date: 1996-Jul-01
Included in the Prior Art Database: 2005-Mar-31

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Related People

Csonka-Peeren, JV Sack, T Tomaiuolo, P [+details]


DRAM Components come in different types of packaging, for instance, two common form factors are 300 mil SOJ and 300 mil TSOPII. The footprint, or "land pattern", of a component defines the size and shape of the copper pads onto which the component leads are soldered. A three-row footprint shown in the Figure which can be populated with either of these packages. In an effort to reduce the total tip-to-tip size of this multi-footprint, Row 1 is "shared" between the SOJ and TSOPII components. The intention of this hybrid footprint is to allow the flexibility of populating with either one of these form factors, while economizing on the real-estate required.