Known Good Dye Test and Direct Chip Attach Assembly
Original Publication Date: 1996-Jul-01
Included in the Prior Art Database: 2005-Mar-31
Disclosed is a technique to deposit low melt solder on the chip C4 bump using an inexpensive method. Having a controlled deposit of low melt solder on the chip C4 pads allows: 1. assembly of the chip to a test carrier for electrical test and burn-in or, 2. assembly of the chip to an organic carrier.