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All Ceramic Packed Computer Disclosure Number: IPCOM000118418D
Original Publication Date: 1997-Feb-01
Included in the Prior Art Database: 2005-Apr-01
Document File: 2 page(s) / 13K

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Abraitis, V: AUTHOR [+2]


Disclosed is a method for manufacturing a computer using solely multilayer ceramic carriers.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 62% of the total text.

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All Ceramic Packed Computer

Disclosed is a method for manufacturing a computer using solely multilayer ceramic carriers.

Instead of using conventional multilayer Printed Circuit Board (PCB) technology for the computer's cards and motherboards, large size multilayer ceramic carriers will be utilized throughout the PC or workstations.

The chips will be packaged directly on such a ceramic card. The shape of such ceramic cards will be optimized for best heat conductance from the chips to the areas contacted by airflow, including the motherboard.

The motherboard will also be composed of a ceramic carrier with ceramic based connectors to the cards. This will allow for improved heat conductance also to the motherboard functioning as an additional fin for the computer's electronics complex. In addition to improved electrical characteristics compared to conventional PCB technology and improved overall chip density, the improved cooling capabilities will allow for using high performance CMOS microprocessors with even higher oscillator frequencies.

Further advantages of such a packaging without organic materials are almost unlimited fire resistivity and operation at higher temperatures of the packaging material, as well as chemical resistivity in aggressive environments.

During manufacture of the proposed ceramic system, it is important that no thermal barriers will occur. Since parts made of resin, like connectors in electronic boards, have a lower thermal conductivity, th...