End Point Detection of Material Removal in Polishing Processes
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02
By monitoring current drawn by a polishing wheel or rotating wafer carrier, completion of removal of a material from a high percentage of area of a surface is detected. For instance, removal of tungsten (W) from an insulating surface on a semiconductor wafer in planarizing for damascene wiring results in a large drop in current to the wafer carrier motor.