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End Point Detection of Material Removal in Polishing Processes Disclosure Number: IPCOM000119749D
Original Publication Date: 1991-Feb-01
Included in the Prior Art Database: 2005-Apr-02

Publishing Venue


Related People

Cote, WJ Cronin, JE Hill, WR Hoffman, C [+details]


By monitoring current drawn by a polishing wheel or rotating wafer carrier, completion of removal of a material from a high percentage of area of a surface is detected. For instance, removal of tungsten (W) from an insulating surface on a semiconductor wafer in planarizing for damascene wiring results in a large drop in current to the wafer carrier motor.