Browse Prior Art Database

Protect Seal for Thin Cell Manufacturing

IP.com Disclosure Number: IPCOM000123113D
Original Publication Date: 1998-May-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Ohkuma, H: AUTHOR [+1]

Abstract

This is an invention about fabrication process of making an assembled array panel with color filter panel (called CELL) thinner by either mechanically polishing or chemically etching techniques. The invented process flow is described as follows. (1) To make 2 different seal patterns onto either array panel or color filter panel with resin adhesive. Inner seal pattern is to work for keeping liquid crystal between array and color filer panels. Outer seal pattern named protection seal, is to work for preventing each electrical pad for driver chips from being damaged during mechanically polishing or chemically etching process. Outside dimension of both array and color filter panels is designed same for easy handling.

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Protect Seal for Thin Cell Manufacturing

   This is an invention about fabrication process of making
an assembled array panel with color filter panel (called CELL)
thinner by either mechanically polishing or chemically etching
techniques.  The invented process flow is described as follows.
  (1) To make 2 different seal patterns onto either array panel
       or color filter panel with resin adhesive.  Inner seal
       pattern is to work for keeping liquid crystal between
       array and color filer panels.  Outer seal pattern
       named protection seal, is to work for preventing each
       electrical pad for driver chips from being damaged
       during mechanically polishing or chemically etching
       process.  Outside dimension of both array and color
       filter panels is designed same for easy handling.
  (2) To assemble array panel and color filter panel,and then
       cure the seal.  (This assembled part is called CELL)
       shown in fig.1.
  (3) To polish both surfaces of cell by either mechanically
       polishing technique or chemically etching technique to
       reduce a cell thickness.
  (4) To cut out between inner seal and protection seal, and
       then all electrical padsare exposed.
  (5) To inject liquid crystal into cell, and then seal the
       port with adhesive shown in Fig.2.