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Method for improved solder joint reliability of pads with microvias

IP.com Disclosure Number: IPCOM000132644D
Publication Date: 2005-Dec-28
Document File: 4 page(s) / 961K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for improved solder joint reliability of pads with microvias. Benefits include improved functionality, improved performance, improved reliability, and improved ease of manufacturing