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Method for package-level integrated electromagnetic absorbing adhesive for RF packaging

IP.com Disclosure Number: IPCOM000132647D
Publication Date: 2005-Dec-28
Document File: 3 page(s) / 68K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for package-level integrated electromagnetic absorbing adhesive for radio frequency (RF) packaging. Benefits include improved functionality and improved performance.