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Creating Flexible Substrates by Coupling Imprinting Technology with a Thin Film Adhesive Temporary Bonding Solution

IP.com Disclosure Number: IPCOM000133495D
Publication Date: 2006-Jan-26

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for making imprinted substrates that are bonded to a host rigid core material by a semi-permanent thin film adhesive. Benefits include enabling finer feature formations and ease of removal of the sacrificial core from the functional substrate build-up layers.