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Disclosed is a method for a new architecture for multi-dimensional packaging. Benefits include better signal integrity, reduced via discontinuity, and reduced manufacturing and design costs.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
73% of the total text.
Multi-Dimensional Package Architecture for Stripline Applications
Disclosed is a method for a new architecture for
multi-dimensional packaging. Benefits include
better signal integrity, reduced
via discontinuity, and reduced manufacturing and design costs.
The uvias in the package contribute to the signal integrity of high
speed I/O path. Their parasitic inductances and resistances degrade the I/O
signal quality and limit the maximum I/O speed. If part of the total uvias is
eliminated from the high speed signal path, the parasitic resistance and
inductance related to uvias are also reduced. The current state of the art
package technology contains issues with manufacturing, design and material costs,
underfill material spread, and an increase in package surface layer real estate
compared to proposed method (see Figure 1).
For the stripline routings in the disclosed method, the
connections are made between the surface and second layers using uvias from the
C4 bumps. The key element of the disclosed method is removing the top copper
and dielectric layer, so that the second top layer connects directly to the C4
bumps. This essentially removes the uvias that exist between the top and second
layers. All the bump patterning is done on the second top layer. This
architecture change targets package types that have the stripline routing (see
Figure 2) that is used by most server products.