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Functionally Graded Substrate Core Material for Improved Solder Joint Reliability

IP.com Disclosure Number: IPCOM000133501D
Publication Date: 2006-Jan-27

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a functionally graded, symmetric core material with through-the-thickness modulus and CTE variations. Benefits include redistributing stresses to achieve lower peak plastic strains.