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Localized, Slightly Collapsed Multi-Perforation Structures to Enhance Contact Integrity Disclosure Number: IPCOM000133573D
Original Publication Date: 2006-Jan-30
Included in the Prior Art Database: 2006-Jan-30

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Lih-Tyng Hwang Junhua (Joshua) Liu


The contact integrity influences directly the performance of a switch, for example, the insertion loss, power handling capability, linearity, and reliability. Unlike the conventional solid state based switches, the MEMS based switches have been considered as a promising technology that delivers low insertion loss and high power handling performance, which are desperately needed in the battery powered mobile devices. It is because in the MEMS based technology, the switches are designed as metal to metal contact, instead of the semiconductor junctions in the solid state based switches. In solid state or any rigid substrate based MEMS, the contact area is small and usually single pointed in nature. It is because the rigidity of the constituting high modulus materials, such as Si, GaAs. In this invention, localized, slightly collapsed multi-perforated structures were proposed in organic MEMS. The proposed contacts are metal to metal, area, and multitude in nature. These carefully designed and implemented structures will help to lower the contact resistance, reduce the spreading resistance, hence, reduce the insertion loss, and increase the power handling capability and linearity.