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Method for using negative-CTE fillers with high-density wire-bonded packages and stacked die packages

IP.com Disclosure Number: IPCOM000133575D
Publication Date: 2006-Jan-31

Publishing Venue

The IP.com Prior Art Database


Disclosed is a method for using negative-coefficient of thermal expansion (CTE) fillers in high-density wire-bonded packages and stacked-die packages. Benefits include improved functionality, improved performance, and improved reliability.