Dismiss
The IQ application will be unavailable on Sunday, November 24th, starting at 9:00am ET while we make system improvements. Access will be restored as quickly as possible.
Browse Prior Art Database

Method for using negative-CTE fillers with high-density wire-bonded packages and stacked die packages

IP.com Disclosure Number: IPCOM000133575D
Publication Date: 2006-Jan-31

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for using negative-coefficient of thermal expansion (CTE) fillers in high-density wire-bonded packages and stacked-die packages. Benefits include improved functionality, improved performance, and improved reliability.