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In Situ Printed Wire Board Package Strain Gage

IP.com Disclosure Number: IPCOM000133576D
Publication Date: 2006-Jan-31

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that incorporates a strain gage into the printed wire board (PWB) or substrate through a subtractive or additive photolithographic process. Benefits include providing a non-destructive, more accurate understanding of the strain levels on the solder joint, and allowing better model validation.