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MEMS-Based Testing for Metallic Materials for Microelectronic Packaging

IP.com Disclosure Number: IPCOM000133578D
Publication Date: 2006-Jan-31

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a MEMS-based testing methodology to examine fatigue and shock properties of metallic materials for microelectronic packaging applications. Benefits include a solution that is more cost-effective than the current state of the art, and is a faster, simpler way to evaluate fundamental material behaviors.