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Single Layer and Dual In-Die Fractal Micro Channel for Micro Chip Cooling

IP.com Disclosure Number: IPCOM000133584D
Publication Date: 2006-Jan-31

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses fractal micro channels embedded in silicon and a micro pump (as a loop-type micro channel heat exchanger) to remove heat from the pump loop. Benefits include cooling multiple components using minimal real state, and more efficient cooling of component hotspots.