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Method for thermal vias and a thin heat spreader for LDI packages with space constraints

IP.com Disclosure Number: IPCOM000133587D
Publication Date: 2006-Jan-31
Document File: 3 page(s) / 222K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for thermal vias and a thin heat spreader for low-density interconnect (LDI) packages with space constraints. Benefits include improved functionality and improved performance.