Browse Prior Art Database

Wafer Scale Kerf Structures

IP.com Disclosure Number: IPCOM000141053D
Original Publication Date: 2006-Sep-29
Included in the Prior Art Database: 2006-Sep-29
Document File: 1 page(s) / 111K

Publishing Venue

IBM

Abstract

Wafer scale kerf structures may be built using technology that stitches together structures in adjacent reticle fields.

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Wafer Scale Kerf Structures

Disclosed is a method to detect and characterize defects on a wafer. This method connects kerf structures in adjacent reticle fields, enabling defect detection and improving test efficiency.

This invention takes advantage of the major pitfall of wafer scale integration - defects. The main function of kerf structures is to detect and characterize defects. Individual reticle kerfs are stitched together into full or partial columns, rows, or grids, and are tested in unison. The invention organizes and uses kerf area, so that wafer kerf structures are tested efficiently. Increased critical area is available for each experiment, while decreasing the number of sites that must be probed and tested. An opens and shorts monitor example is given in Fig. 1. Arrows in Fig. 1 mark the location of test pads, labeled A, B, C, and D. Other kerf designs could be implemented with this approach. Also, kerf structures and circuits could be designed to provide defect localization.

Opens and shorts monitor example:
1) Design the kerf in a modular fashion, to connect properly to adjacent kerf structures by following stitching ground rules.
2) Manufacture wafer hardware with a process that connects adjacent kerfs in the desired manner.
3) Test kerf structures to detect opens and shorts.

To test for opens, measure continuity along a wire. For...

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