Browse Prior Art Database

Flexible Electronics: Transformational Technology for Revolutionary Applications (Part 2 -- Roadmapping, Global Standards, and Design for Sustainability) Disclosure Number: IPCOM000166796D
Original Publication Date: 2008-Jan-01
Included in the Prior Art Database: 2008-Jan-24
Document File: 40 page(s) / 2M

Publishing Venue


Related People

Paul W. Brazis, Jr. PhD: AUTHOR [+4]


If electronic components could be built on large, flexible sheets of film. what could we expect the end products to be for these revolutionary applications in consumer and industrial electronics, energy, healthcare, civil infrastructure and defense? There is an ever-increasing interest in using printing approaches to fabricate electronic, optical and optoelectronic devices and components on a macro, as well as micro scale. These technologies also promise further savings in fabrication costs, which can make products much more widely available to everyone. To do this we need an understanding of the benefits and barriers to the various printing techniques and the compatibility of materials and substrate surfaces, which are critical factors in the ultimate success of printed devices. Learn about this emerging industry for printed electronics and the potential it holds for applications in displays, sensors, telecommunications, and solid state lighting. This course is not only intended for newcomers, but also those who want to broaden their understanding or catch up on the latest developments in flexible, printed and organic electronics.

This text was extracted from a Microsoft PowerPoint presentation.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 22% of the total text.

Slide 1 of 40

Printed Electronics

Roadmapping, Global Standards, and Design for Sustainability

21 January 2008

[This slide contains 6 pictures or other non-text objects]


Add technology slides in the backup if it does not exist.

Slide 2 of 40


Global Standards:

How do I measure

and communicate?


What path do we follow?

What is important to the

industry? And when?

Design for Sustainability:

How do I proceed responsibly?

Can I get ROI from green tech?

Slide 3 of 40

Global Standards

Slide 4 of 40

Why Use Standards for Testing?

Device performance reported in standard way in silicon world

Standard method of reporting device performance data necessary

  Based on current silicon methods

  Development and oversight by IEEE, ISO, etc.

[This slide contains 2 pictures or other non-text objects]

Slide 5 of 40

Standards Attributes

What standards ARE:

  Useful tools

  Guidelines for complex processes

  Characterization standards

  Reporting standards

  Critical for building a value chain

  Quality control and monitoring


  Catalyst for moving a new technology forward

  Eases sharing of information

  Claims can be more easily assessed and verified

What standards ARE NOT:

  Barriers to creative ideas

  Rather, should capture best practices and procedures

  Unchangeable documents set in stone

  Revisiting and revising an IEEE standard is MANDATORY

  Exclusively for mature products

  But can help move technology towards commercialization

Slide 6 of 40

Case Study

IEEE 1620™

  What was the need?

  Uneven knowledge base for electrical characterization of carbon nanotubes

  Unknown techniques used

  Inconsistent reporting

  What did the standard strive to do?

  Gather the best attainable knowledge, share with community

  Encourage disclosure of measurement techniques

  Be a catalyst for technology and product development

Slide 7 of 40

Requirements for Equipment

Calibrated against a known source

  NIST, etc.

  Calibrates according to manufacturer’s recommendations

  Re-calibrate if significant environmental changes occur

Sufficient resolution and accuracy

  +/- 0.1%, e.g., 1 fA if gate leakage is 1 pA

  Input impedance >> device impedance (1016Ω recommended)

Adequate shielding

  Triaxial wiring throughout system


  Proper interconnect

  Grounded dark box enclosure, ground chuck, etc.

Slide 8 of 40

Other Reporting Information

Focus on disclosure to maximize repeatability and verification

  General device structure info

  bottom gate, top contact, etc.


  channel length, width, dielectric data

  Substrate information

  General process info

  vacuum, spin coating, etc., for all layers

  Storage and environmental information

  Humidity, temperature, atmosphere (storage and measurement)

  Sample size and repeatability

  average, standard deviation over several samples

Slide 9 of 40

Minimum Reporting Standards


Standard Symbol