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Thermal Aware Design Rule Checking of Chip Layout

IP.com Disclosure Number: IPCOM000172857D
Publication Date: 2008-Jul-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Abstract: Temperature has a significant effect on many parameters of design rules such as: interconnect design rules, reliability design rules, and electromigration rules. Different regions of a chip operate at different temperature and hence checking the complete design against one set of design rules leads to sub-optimal design and wasted designer effort in fixing design rule violations. We propose to check different thermal regions of a chip against different sets of design rules depending on their expected thermal behavior. This leads to fewer violations in the colder region and more design effort to fix violations in the hotter regions. This increases the yield and reliability.