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Thermal Aware Variable Sizing of Interconnects Disclosure Number: IPCOM000172864D
Publication Date: 2008-Jul-16

Publishing Venue

The Prior Art Database


Abstract: Temperature has a significant effect on electromigration in interconnects. It is estimated that with each 10°C increase in temperature, the current carrying capacity (ampere per mm2 of cross section area) of an interconnect in halved. Different regions of a chip operate at different temperature and hence having an uniform-width interconnect leads to sub-optimal design and wasted area. We propose to have non-uniform interconnects, i.e. wider interconnects in the hot regions of the chip and narrower interconnects in the cold region. This thermal aware interconnect design leads to improved reliability, reduced cross talk, area savings, and better routability.