Browse Prior Art Database

Laser Wafer Pattern Removal Process

IP.com Disclosure Number: IPCOM000184432D
Original Publication Date: 2009-Jun-24
Included in the Prior Art Database: 2009-Jun-24

Publishing Venue

IBM

Abstract

Semiconductor scrap material is typically handled as chemical waste. This causes quite some cost to chemically dispose the scrap material correct. An initial step to reclaim semiconductor scrap for re-use in the solar industry is to sand blast the scrap to remove the pattern. The sand blast is not always able to remove lead from the pattern. This would require an additional etching step. Etching itself is also able to remove the pattern from scrap material. Etching as well as sand blasting are time consuming and require high operational effort and chemical permits. New methods are required to improve the quality of pattern removal. This could be laser method, discussed here, which also enables complete lead removal.