Dismiss
We will be performing system updates on Sunday, July 21st, from 9-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Method to dice a thinned wafer adhesively bonded to a glass support

IP.com Disclosure Number: IPCOM000192703D
Original Publication Date: 2010-Jan-29
Included in the Prior Art Database: 2010-Jan-29
Document File: 1 page(s) / 31K

Publishing Venue

IBM

Abstract

Disclosed is a method for bonding a glass support to a wafer so that the glass support may be used during and after wafer dicing.