The following operators can be used to better focus your queries.
( ) , AND, OR, NOT, W/#
? single char wildcard, not at start
* multi char wildcard, not at start
(Cat? OR feline) AND NOT dog?
Cat? W/5 behavior
(Cat? OR feline) AND traits
Cat AND charact*
This guide provides a more detailed description of the syntax that is supported along with examples.
This search box also supports the look-up of an IP.com Digital Signature (also referred to as Fingerprint); enter the 72-, 48-, or 32-character code to retrieve details of the associated file or submission.
Concept Search - What can I type?
For a concept search, you can enter phrases, sentences, or full paragraphs in English. For example, copy and paste the abstract of a patent application or paragraphs from an article.
Concept search eliminates the need for complex Boolean syntax to inform retrieval. Our Semantic Gist engine uses advanced cognitive semantic analysis to extract the meaning of data. This reduces the chances of missing valuable information, that may result from traditional keyword searching.
Disclosed is a method for bonding a glass support to a wafer so that the glass support may be used during and after wafer dicing.
English (United States)
This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
95% of the total text.
Page 1 of 1
Method to dice a thinned wafer adhesively bonded to a glass support
In certain 3D stacked die applications, it is desired to assemble some or all of the semiconductor integrated circuit (IC) die in a given stack at the die level, therefore requiring that the die are first individually diced from the semiconductor wafer. Semiconductor wafers that are used for die stacking must be thinned at some stage during the semiconductor wafer processing and therefore require that a "wafer-sized" glass support structure is adhesively bonded to said semiconductor wafer in order to provide mechanical support to the wafer during those operations that follow the wafer thinning operation.
The wafer adhered to a glass support is illustrated here, showing a wafer (including thru-vias and interconnect "bumps"), the glass and the adhesive that affixes the two:
The approach to partially dice only the wafer portion of the above structure is shown here:
The method proposed in this invention to effect the partial dicing is shown here, whereby the wafer portion is shown to have mechanical dicing "grooves" that stop at varying degrees within the thickness of the thin wafer portion, after which the laser (depicted by the "wavy" lines) completes the dicing process by progressing through the remaining wafer thickness.
The laser light's wavelength is selected such that...