Browse Prior Art Database

Method to dice a thinned wafer adhesively bonded to a glass support

IP.com Disclosure Number: IPCOM000192703D
Original Publication Date: 2010-Jan-29
Included in the Prior Art Database: 2010-Jan-29

Publishing Venue

IBM

Abstract

Disclosed is a method for bonding a glass support to a wafer so that the glass support may be used during and after wafer dicing.