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Method and System for Monitoring Across-Die Variations in Chips Using In-Built Leakage Reduction Techniques Disclosure Number: IPCOM000197639D
Publication Date: 2010-Jul-19

Publishing Venue

The Prior Art Database


A method and system is disclosed for monitoring across-die variations in chips. The method and system exploits in-built leakage reduction techniques to estimate across-die variations through multiple IDDQ measurements.