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Method and System for Mitigating Electromigration Effects by Creating Metal Topologies for Preferred Grain Boundary Formation

IP.com Disclosure Number: IPCOM000197734D
Publication Date: 2010-Jul-20

Publishing Venue

The IP.com Prior Art Database

Abstract

A method and system for reducing electromigration effects in a circuit is disclosed. The method includes minimizing grain boundary movement along the direction of a current flow. Further, the method facilitates in increasing the median time to failure of the metal line while maintaining voltage at slotted areas and reducing layout area of the circuit being constructed.