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Method and System for a Conductive Cu Plug Cap for an Aluminum Pad Elimination Process

IP.com Disclosure Number: IPCOM000197736D
Publication Date: 2010-Jul-20

Publishing Venue

The IP.com Prior Art Database

Abstract

A method and system for a conductive final wiring level Cu plug cap is disclosed, which enables the replacement of the final aluminum pad level in the BEOL process flow. A conductive layer is used together with a modified final-passivation level polyimide mask, to allow for protection of the underlying copper metal during polyimide cure, and for electrical isolation of the final connection contact structures.