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Tubular Thermal Conduction Slugs and PCB pads

IP.com Disclosure Number: IPCOM000198227D
Original Publication Date: 2010-Jul-31
Included in the Prior Art Database: 2010-Jul-31

Publishing Venue

Motorola

Related People

Inventors:
Strzelczyk, Martin Strzelczyk, Robert Zanatta, Thomas

Abstract

This disclosure proposes an alternative to solid cylindrical heat slugs in surface mount applications which are subject to misalignment from: solder doming, uneven surface tension, and gaseous expansion in voids present inside vias of modern PCBs (Printed Circuit Boards). By hollowing the cylinder, and modifying the accompanying PCB pad, the mechanical and thermal performance of surface mount thermal slugs can be improved.