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Tubular Thermal Conduction Slugs and PCB pads Disclosure Number: IPCOM000198227D
Original Publication Date: 2010-Jul-31
Included in the Prior Art Database: 2010-Jul-31

Publishing Venue


Related People

Strzelczyk, Martin Strzelczyk, Robert Zanatta, Thomas


This disclosure proposes an alternative to solid cylindrical heat slugs in surface mount applications which are subject to misalignment from: solder doming, uneven surface tension, and gaseous expansion in voids present inside vias of modern PCBs (Printed Circuit Boards). By hollowing the cylinder, and modifying the accompanying PCB pad, the mechanical and thermal performance of surface mount thermal slugs can be improved.