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Lithography system for processing a target, such as a wafer, and a method for operating a lithography system for processing a target, such as a wafer

IP.com Disclosure Number: IPCOM000207550D
Publication Date: 2011-May-31

Publishing Venue

The IP.com Prior Art Database

Abstract

The invention relates to a lithography system for processing a target, such as a wafer. The lithography system comprises a beam source arranged for providing a patterning beam, a final projection system arranged for projecting a pattern on the target surface, a chuck arranged for supporting the target and a mark position system arranged for detecting a position mark on a surface.