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METHOD OF CREATING TAPERED PROFILE IN TSV ETCHING BY USING ALTERNATIVE BOSCH PROCESS AND SIDEWALL COATING

IP.com Disclosure Number: IPCOM000207992D
Publication Date: 2011-Jun-17
Document File: 6 page(s) / 44K

Publishing Venue

The IP.com Prior Art Database

Related People

Authors:
Frank Y. Lin Camelia Rusu

Abstract

A number of Bosch process and sidewall coating process cycles are performed. Then a final post treatment process is performed to smooth the sidewall. The result is a single via having a smooth tapered sidewall. The angle of the sidewall may be easily controlled by controlling parameters of the etching/SC cycles.