METHOD OF CREATING TAPERED PROFILE IN TSV ETCHING BY USING ALTERNATIVE BOSCH PROCESS AND SIDEWALL COATING
Publication Date: 2011-Jun-17
The IP.com Prior Art Database
A number of Bosch process and sidewall coating process cycles are performed. Then a final post treatment process is performed to smooth the sidewall. The result is a single via having a smooth tapered sidewall. The angle of the sidewall may be easily controlled by controlling parameters of the etching/SC cycles.