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A New Method of Compensating for BGA Package Warpage Disclosure Number: IPCOM000209379D
Publication Date: 2011-Aug-02
Document File: 3 page(s) / 83K

Publishing Venue

The Prior Art Database


The article proposes a new method for compensating BGA package warpage. The method is characterized of adding a solder paste deposition step on component side before component placement. The paste volumes deposited on component side are different depending on the thermal bending configuration of component body.